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Patent application: Systems for thermal management

Ben Welter - Thursday, March 08, 2018

U.S. patent application 20180068924 (Henkel IP & Holding GmbH, Dusseldorf, Germany):

"A heat-dispersing article comprising: a first conductive/protective layer, one or more porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM) so as to substantially cover the surface and voids of said porous thermally conductive, low-profile structure, wherein said formulated PCM comprises said PCM containing 5-20% by weight of a gelling agent mixed with said PCM, and a second conductive/protective layer, wherein said one or more porous thermally conductive, low-profile structure(s) are sandwiched between said first and second conductive/protective layers, and wherein said article has: a latency of at least 100 J/cc, and an effective thermal conductivity of at least 10 W/mK."

http://www.freepatentsonline.com/20180068924.pdf

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