U.S. patent application 20180289531 (applicant Relief Technologies Inc., San Francisco, Calif.):
"A cooling device includes a package substrate, a plurality of cooling units, and device electronics. The plurality of cooling units are configured to cool a user's body. Each cooling unit includes a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate. Each of the cooling units is connected to the package substrate. The device electronics are coupled to the cooling units. The device electronics are configured to store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time. The device electronics are configured to deliver power to the cooling units according to the first cooling device profile, wirelessly receive a second cooling device profile from an external computing device, and deliver power to the cooling units according to the second cooling device profile."