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Patent application: Insulation material arrangement

Ben Welter - Friday, May 24, 2019

Wall insulation material patent drawing

U.S. patent application 20190153722 (applicant Schmetzer Industries Holdings Pty Ltd, Hornsby, Australia):

"An insulating material arrangement (10) is disclosed for insulating a building structure such as a wall. The material arrangement includes a planar backing layer (12), a planar adhesive layer (14) co-planar with the backing layer and a planar phase change material (“PCM”) layer (16) which is arranged between the backing layer and the adhesive layer, and is also co-planar therewith. The adhesive layer is adapted to secure the material arrangement to the structure in a fitted condition in which the adhesive layer is contacted with the building structure. The PCM layer is formed of a silicone foam polymer that is impregnated in some embodiments with micro-encapsulated phase change material in the form of beads, shells or granules, and in another arrangement, the PCM layer can also comprise a silicone foam polymer that is impregnated with a phase change material which is absorbed into an amount of porous, inorganic, finely-sized particulate solids (a so-called “bound PCM”)."

http://www.freepatentsonline.com/20190153722.pdf

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