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Patent application: Enclosure cooling for thermal management of unmanned aerial vehicles

Ben Welter - Friday, January 11, 2019

Qualcomm drone patent drawing

U.S. patent application 20190009878 (applicant Qualcomm Inc., San Diego, Calif.):

"Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV."

http://www.freepatentsonline.com/20190009878.pdf

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