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Patent application: 3-D electronic structure with integrated phase-change cooling

Ben Welter - Saturday, June 22, 2019

Google patent drawingU.S. patent application 20190191589 (applicant Google LLC, Mountain View, Calif.):

"This document describes techniques for implementing phase-change cooling in a three-dimensional structure. A three-dimensional structure having three-dimensional curvatures is fabricated to include a phase-change chamber with a fluid in a saturated thermodynamic state. As part of fabrication, specific mechanisms may be included that create a thermo-mechanical network that improves thermal performance of the phase-change chamber and also provides structural integrity to the three-dimensional structure. ... Structures housing heat-producing components, such as a virtual reality headset, a personal assistant/smart speaker, a smartphone, or gaming controller, are often shaped with complex, three-dimensional curvatures. As part of manufacturing such a structure and using specific techniques, phase-change mechanisms using a phase-change material (PCM) may be integrated as part of the structure, improving thermal control over the electronic system that might otherwise rely on convection or conduction based mechanisms."

http://www.freepatentsonline.com/20190191589.pdf

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