Patent application 20150060017: "The cooling apparatus includes a pipeline, a housing enclosing the pipeline, and the solid-liquid PCM filling in an interior of the pipeline and a space between the pipeline and the housing. The solid-liquid PCM can contact a heat source and absorb the heat generated by the heat source, so as to transform from solid state to liquid state. The solid-liquid PCM in the liquid state can circulate inside the pipeline and the space between the pipeline and the housing. Thus, the heat is dissipated by the means of thermal convection. Meanwhile, the heat also can be dissipated through the housing. Therefore, the heat dissipation can be achieved by thermal conduction and heat convection simultaneously."